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99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging

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99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging

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Brand Name : WINNER

Model Number : BC001

Certification : ISO9100

Place of Origin : CHINA

MOQ : 1PC

Price : 999

Payment Terms : L/C, Western Union, T/T Supply Ability

Supply Ability : 100000 rolls per month

Delivery Time : 5-8 WORKING DAYS

Packaging Details : Roll, Neutrial Packing or with OEM LOGO

Purity : 99.999%

Bonding Method : Ultrasonic

Product Type : Bonding Wire

Diameter : 0.01-0.4mm

Length Meters : 500/1000

Thermal Conductivity : 318 W/mK

Application : Semiconductor Packaging

Package : Spool

Flexibility : High

Package Weight : 2.2 pounds

Electrical Conductivity : 45.5 MS/m

Tensile Strength : 100 ksi

Melting Point : 1064°C

Density : 8.96 g/cm3

Wire Diameter : 0.001 inches

Coating Thickness : 0.001mm

Material : Copper

Coating : Berullium

Corrosion Resistance : High

Temperature Range : -40°C to 200°C

Surface Finish : Bright

Conductivity : 98%

Package Size : 100 meters

Bond Strength : High

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Product Description

Our Ultra-fine Coated Beryllium Copper (BeCu) Wire is designed for applications requiring exceptional electrical conductivity, superior thermal performance, and high mechanical strength in a compact form factor.
With diameters as small as 0.015mm, this wire combines the strength of beryllium copper with the protective benefits of advanced surface coatings, ensuring long-term stability and resistance to oxidation, corrosion, and wear.

Produced under strict quality control in an ISO-certified facility, this wire is widely used in precision electronics, high-frequency connectors, aerospace, medical devices, and miniature spring contacts. Its excellent fatigue resistance and high resilience make it ideal for demanding environments where consistent performance is critical.


Key Features & Benefits

Ultra-fine Diameter Range: 0.015mm–0.2mm for micro-scale applications

Outstanding Electrical Conductivity: Copper-rich alloy ensures fast, stable signal transmission

Excellent Thermal Performance: Effective heat dissipation for high-load applications

High Mechanical Strength: Beryllium copper core provides superior durability and elasticity

Protective Coating: Enhances corrosion resistance and prolongs service life

Customizable Specifications: Diameter, coating material, and spool size tailored to your needs


Applications

High-frequency connectors and coaxial cables

Semiconductor test probes and contact springs

Precision electrical instruments and sensors

Aerospace and defense electronics

Medical device wiring and miniature actuators


Technical Specifications

Material: High-strength beryllium copper alloy with protective coating (Ni, Pd, Au, etc.)

Purity: Cu ≥ 99%

Diameter Range: 0.015mm–0.2mm (custom sizes available)

Tensile Strength: ≥ 1,000 MPa (varies by size)

Elongation: ≥ 2%

Surface Coating Thickness: As per customer requirements

Packaging: Cleanroom-grade spools, moisture-proof sealed packing


99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging



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